In the process of depanelling market requirements increased extremely over the last years. Panels – carrying printed circuit boards – come in many different materials as in example FR4, plastics, ceramics, aluminium, copper or in various material thicknesses and are always to be depanelled in the same quality of cut. On top it is requested that the process of production is as stress- and dust-reduced as possible not to harm the sensible parts. A short process-time and the possibility to be quick and comfortable in changing production becomes more and more important. At this stage we offer solutions for all requirements as for manuel, semiautomatic, fully automatic depanelling with a mix of routing and cutting for highly sophisticated depanelling requirements.